Month: April 2023

Conference / Workshop

(日本語) FLEPS2023 採択決定

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The following paper has been accepted for the IEEE International Conference on Flexible, Printable Sensors and Systems (FLEPS 2023) to be held in Boston, USA, in July 2023. This research results from joint research with the National Institute of Advanced Industrial Science and Technology (AIST).

Qin Zhaoxing, Kunihiro Oshima, Kazunori Kuribara, and Takashi Sato, “OPTL: Robust and area-efficient pass gate logic for organic transistors,” in Proc. IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS), to appear.

Conference / Workshop

IRPS 2023

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Kazusa Takami gave a poster presentation at International Reliability Physics Symposium (IRPS) on March 29, held in Monterey CA, USA from March 26 to 30, 2023.

K. Takami, Y. Gomi, S. Abe, W. Liao, S. Manabe, T. Matsumoto, and M. Hashimoto, “Characterizing SEU Cross Sections of 12- and 28-nm SRAMs for 6.0, 8.0, and 14.8 MeV Neutrons,” Proceedings of International Reliability Physics Symposium (IRPS), 2023.

Conference / Workshop

ICMTS2023

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Niiyama-kun (M1) presented his research at International Conference on Microelectronic Test Structures (ICMTS 2023) held at the University of Tokyo from March 27 to 30, 2023.

  • K. Niiyama, H. Awano, and T. Sato, “Introducing transfer learning framework on device modeling by machine learning,” in Proc. IEEE International Conference on Microelectronic Test Structures (ICMTS), pp.158-163, March 2023.