Conference / Workshop

Paper accepted: ASP-DAC 2024

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The following papers have been accepted for Asia and South Pacific Design Automation Conference (ASP-DAC) to be held in Incheon, Korea, in January 2024.

  • K. Suemitsu, K. Matsuoka, T. Sato, and M. Hashimoto, “Logic Locking Over TFHE for Securing User Data and Algorithms,” Proceedings of Asia and South Pacific Design Automation Conference (ASP-DAC), 2024, to appear.
  • K. Oshima, K. Kuribara, and T. Sato, “Design of aging-robust clonable PUF using organic thin-film transistors and insulator-based ReRAM,” in Proc. ACM/IEEE Asia and South Pacific Design Automation Conference (ASPDAC), 2024, to appear.
Publication

IEEE Transactions on Circuits and Systems I: Paper accepted

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The paper below has been accepted for publication in IEEE Transactions on Circuits and Systems I: Regular Papers.

Q. Cheng, M. Huang, C. Man, A. Shen, L. Dai, H. Yu, and M. Hashimoto, “Reliability Exploration of System-On-Chip with Multi-Bit-Width Accelerator for Multi-Precision Deep Neural Networks,” IEEE Transactions on Circuits and Systems I: Regular Papers, in early access, DOI: 10.1109/TCSI.2023.3300899.

Conference / Workshop

DAC2023

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At the Design Automation Conference (DAC) held July 9-13, 2023 in San Francisco, California, USA, Ikeda (M2) gave a poster presentation in the WIP session.

S. Ikeda, H. Awano, and T. Sato, “No-NL DFR: New model of digital delayed feedback reservoir without nonlinear elements”

Conference / Workshop

SSDM 2023: Paper accepted

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The following paper has been accepted for presentation at the International Conference on Solid State Devices and Materials (SSDM) 2022. This work is the result of joint research with National Institute of Advanced Industrial Science and Technology (AIST).

  • H. Urabe, K. Oshima, and T. Sato, “Feasibility study of PLL-based analog-to-digital converter for low-voltage organic thin-film transistors,” in Proc. International Conference on Solid State Devices and Materials (SSDM), September 2023. (to appear)
  • K. Kuribara, A. Takei, T. Sato, and M. Yoshida, “Low voltage operation of organic thin-film transistor with atmospheric coating of high-k polymer dielectric,” in Proc. International Conference on Solid State Devices and Materials (SSDM), September 2023. (to appear)
Conference / Workshop/Publication

Paper accepted: ACM TECS

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The following paper has been accepted for publication in ACM Transactions on Embedded Computing Systems (TECS). This research will be presented orally at the International Conference on Compilers, Architectures, and Synthesis for Embedded Systems (CASES), one of the international conferences comprising Embedded System Week (ESWeek), to be held in Hamburg, Germany, in September 2023.

Sosei Ikeda, Hiromitsu Awano, and Takashi Sato, “Modular DFR: Digital delayed feedback reservoir model for enhancing design flexibility,” ACM Transactions on Embedded Computing Systems (TECS), accepted for publication.

Conference / Workshop

Paper accepted: ITC 2023

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The following paper has been accepted for the International Test Conference (ITC 2023) to be held in Anaheim, USA, in October 2023. This work is the outcome of joint research with Sony Semiconductor Manufacturing, Kyoto Institute of Technology, and Nara Institute of Science and Technology.

Makoto Eiki, Tomoki Nakamura, Masuo Kajiyama, Michiko Inoue, Takashi Sato and Michihiro Shintani, “Improving efficiency and robustness of Gaussian process based outlier detection via ensemble learning,” in Proc. International Test Conference (ITS) 2023, to appear.

Conference / Workshop

Papers accepted at RADECS 2023

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The following papers have been accepted for the European Conference on Radiation and Its Effects on Components and Systems (RADECS) 2023, scheduled to be held in Toulouse, France, in September 2023:

Y. Gomi, K. Takami, R. Mizuno, M. Niikura, Y. Deng, S. Kawase, Y. Watanabe, S. Abe, W. Liao, M. Tampo, I. Umegaki, S. Takeshita, K. Shimomura, Y. Miyake, and M. Hashimoto, “Muon-Induced SEU Cross Sections of 12-nm FinFET and 28-nm Planar SRAMs,” Proceedings of European Conference on Radiation and Its Effects on Components and Systems (RADECS), to appear.

M. Yoshida, R. Iwamoto, M. Itoh, and M. Hashimoto, “Stuck Errors in Bits and Blocks in GDDR6 under High-Energy Neutron Irradiation,” Proceedings of European Conference on Radiation and Its Effects on Components and Systems (RADECS), to appear in Data workshop.

Announcement

Press Release: Advancements in Accelerating Reliability Evaluation of Electronic Devices – Development of Technology Enabling Semiconductor Soft Error Evaluation in Various Neutron Facilities

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Regarding the research achievements of JST OPERA, a joint press release was conducted on June 5, 2023, by the Japan Atomic Energy Agency, Socionext Inc., HIREC Corporation, Kyoto Institute of Technology, and Kyushu University.

With this method, it becomes possible to evaluate soft error rates using numerous general neutron sources both domestically and internationally, without the need for limited special neutron sources. This enables meeting the increasing demand for soft error rate evaluation.

This press release is based on the paper below.

S. Abe, M. Hashimoto, W. Liao, T. Kato, H. Asai, K. Shimbo, H. Matsuyama, T. Sato, K. Kobayashi, and Y. Watanabe, “A Terrestrial SER Estimation Methodology Based on Simulation Coupled with One-Time Neutron Irradiation Testing,” IEEE Transactions on Nuclear Science, in early access.
DOI: 10.1109/TNS.2023.3280190

Relatedly, it was covered by EE Times Japan on June 7, 2023.

Publication

IEEE Transactions on Nuclear Science: Paper accepted

by users

The paper below has been accepted for publication in IEEE Transactions on Nuclear Science. This is a joint work with Japan Atomic Energy Agency, University of Tokyo, Socionext, HIREC, Hitachi, Kyoto Institute of Technology and Kyushu University.

S. Abe, M. Hashimoto, W. Liao, T. Kato, H. Asai, K. Shimbo, H. Matsuyama, T. Sato, K. Kobayashi, and Y. Watanabe, “A Terrestrial SER Estimation Methodology Based on Simulation Coupled with One-Time Neutron Irradiation Testing,” IEEE Transactions on Nuclear Science, in early access.
DOI: 10.1109/TNS.2023.3280190