Paper accepted: ASP-DAC 2024

The following papers have been accepted for Asia and South Pacific Design Automation Conference (ASP-DAC) to be held in Incheon, Korea, in January 2024.

  • K. Suemitsu, K. Matsuoka, T. Sato, and M. Hashimoto, “Logic Locking Over TFHE for Securing User Data and Algorithms,” Proceedings of Asia and South Pacific Design Automation Conference (ASP-DAC), 2024, to appear.
  • K. Oshima, K. Kuribara, and T. Sato, “Design of aging-robust clonable PUF using organic thin-film transistors and insulator-based ReRAM,” in Proc. ACM/IEEE Asia and South Pacific Design Automation Conference (ASPDAC), 2024, to appear.

DAC2023

At the Design Automation Conference (DAC) held July 9-13, 2023 in San Francisco, California, USA, Ikeda (M2) gave a poster presentation in the WIP session.

S. Ikeda, H. Awano, and T. Sato, “No-NL DFR: New model of digital delayed feedback reservoir without nonlinear elements”

SSDM 2023: Paper accepted

The following paper has been accepted for presentation at the International Conference on Solid State Devices and Materials (SSDM) 2022. This work is the result of joint research with National Institute of Advanced Industrial Science and Technology (AIST).

  • H. Urabe, K. Oshima, and T. Sato, “Feasibility study of PLL-based analog-to-digital converter for low-voltage organic thin-film transistors,” in Proc. International Conference on Solid State Devices and Materials (SSDM), September 2023. (to appear)
  • K. Kuribara, A. Takei, T. Sato, and M. Yoshida, “Low voltage operation of organic thin-film transistor with atmospheric coating of high-k polymer dielectric,” in Proc. International Conference on Solid State Devices and Materials (SSDM), September 2023. (to appear)

Paper accepted: ACM TECS

The following paper has been accepted for publication in ACM Transactions on Embedded Computing Systems (TECS). This research will be presented orally at the International Conference on Compilers, Architectures, and Synthesis for Embedded Systems (CASES), one of the international conferences comprising Embedded System Week (ESWeek), to be held in Hamburg, Germany, in September 2023.

Sosei Ikeda, Hiromitsu Awano, and Takashi Sato, “Modular DFR: Digital delayed feedback reservoir model for enhancing design flexibility,” ACM Transactions on Embedded Computing Systems (TECS), accepted for publication.

Paper accepted: ITC 2023

The following paper has been accepted for the International Test Conference (ITC 2023) to be held in Anaheim, USA, in October 2023. This work is the outcome of joint research with Sony Semiconductor Manufacturing, Kyoto Institute of Technology, and Nara Institute of Science and Technology.

Makoto Eiki, Tomoki Nakamura, Masuo Kajiyama, Michiko Inoue, Takashi Sato and Michihiro Shintani, “Improving efficiency and robustness of Gaussian process based outlier detection via ensemble learning,” in Proc. International Test Conference (ITS) 2023, to appear.

Papers accepted at RADECS 2023

The following papers have been accepted for the European Conference on Radiation and Its Effects on Components and Systems (RADECS) 2023, scheduled to be held in Toulouse, France, in September 2023:

Y. Gomi, K. Takami, R. Mizuno, M. Niikura, Y. Deng, S. Kawase, Y. Watanabe, S. Abe, W. Liao, M. Tampo, I. Umegaki, S. Takeshita, K. Shimomura, Y. Miyake, and M. Hashimoto, “Muon-Induced SEU Cross Sections of 12-nm FinFET and 28-nm Planar SRAMs,” Proceedings of European Conference on Radiation and Its Effects on Components and Systems (RADECS), to appear.

M. Yoshida, R. Iwamoto, M. Itoh, and M. Hashimoto, “Stuck Errors in Bits and Blocks in GDDR6 under High-Energy Neutron Irradiation,” Proceedings of European Conference on Radiation and Its Effects on Components and Systems (RADECS), to appear in Data workshop.

Paper accepted at IOLTS 2023

The following paper has been accepted for IEEE International Symposium on On-Line Testing and Robust System Design (IOLTS) to be held in Chania (Crete), Greece, in July 2023.

R. Iwamoto and M. Hashimoto, “Avoiding Soft Error-Induced Illegal Memory Accesses in GPU with Inter-Thread Communication,” Proceedings of International Symposium on On-Line Testing and Robust System Design (IOLTS), to appear.

(日本語) FLEPS2023 採択決定

The following paper has been accepted for the IEEE International Conference on Flexible, Printable Sensors and Systems (FLEPS 2023) to be held in Boston, USA, in July 2023. This research results from joint research with the National Institute of Advanced Industrial Science and Technology (AIST).

Qin Zhaoxing, Kunihiro Oshima, Kazunori Kuribara, and Takashi Sato, “OPTL: Robust and area-efficient pass gate logic for organic transistors,” in Proc. IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS), to appear.