The following paper has been published at IACR TCHES. The paper will be presented at International Conference on Cryptographic Hardware and Embedded Systems (CHES) in September 2026.
The following paper has been accepted for publication in IEEE Transactions on Computers. This research is the result of a collaborative study with Waseda University.
The following paper has been accepted for presentation at the IEEE International Conference on Microelectronic Test Structures (ICMTS) 2026,
which will be held in Matsue, Japan, from March 23 to 26, 2026.
The following paper has been accepted to CICC (IEEE Custom Integrated Circuits Conference) 2026. We will present the results in April 2026.
The following paper has been accepted for IRPS 2026. It will be presented in Tucson, Arizona, in March 2026.
Yuibi Gomi, Kazusa Takami, Koyo Morita, and Masanori Hashimoto, “Proton-Induced Distant MCU Analysis with Quasi Event-Wise Dynamic Measurement in 22-nm and 55-nm SRAMs,” Proceedings of International Reliability Physics Symposium (IRPS), to appear.
An IEEE CAS Industrial Distinguished Lecture was held on December 17, 2025, featuring a presentation by Mr. Koji Nii from TSMC Design Technology Japan.
Two distinguished EDA researchers visited our laboratory to exchange ideas and deliver the following technical lectures (November 28, 2025).
Title: Physical Design for Heterogeneous Integration: Challenges and Opportunities
Speaker: Prof. Yao–Wen Chang (National Taiwan University)
Title: Automated Finger Placement for Wire-Bonding Packages Using a Double-Square Analytical Framework
Speaker: Prof. Jai-Ming Lin (National Cheng Kung University)
Sorry, this entry is only available in 日本語.
The following papers have been accepted for ISSCC 2026.
We will present our results in San Francisco in February 2026.
S. Xu*, K. Liu*, L. Chan, H. Tagawa, H. Shinohara, K. Niitsu, “A Sub-Threshold All-nMOS Reconfigurable PUF with Secure Configuration Selection for Stable 6-Bits/Cell,” Technical Digest of International Solid-State Circuits Conference (ISSCC), to appear. (*ECAs)
Q. Cheng*, Z. Yang*, H. Li, Q. Li, Z. Kong, G. Niu, Y. Liang, J. Li, J. Yoo, M. Hashimoto, and L. Lin, “A Radiation-Hardened Self-Healing Cmos Imager with Online Pixel/Logic Annealing and Tile-Adaptive Compression for Space Applications,” Technical Digest of International Solid-State Circuits Conference (ISSCC), to appear. (*ECAs)
The following papers have been accepted for DATE 2026.
We will present our results in Verona, Italy, in April 2026.