Paper accepted for IRPS 2026

The following paper has been accepted for IRPS 2026. It will be presented in Tucson, Arizona, in March 2026.

Yuibi Gomi, Kazusa Takami, Koyo Morita, and Masanori Hashimoto, “Proton-Induced Distant MCU Analysis with Quasi Event-Wise Dynamic Measurement in 22-nm and 55-nm SRAMs,” Proceedings of International Reliability Physics Symposium (IRPS), to appear.

Technical seminar

Two distinguished EDA researchers visited our laboratory to exchange ideas and deliver the following technical lectures (November 28, 2025).

Title: Physical Design for Heterogeneous Integration: Challenges and Opportunities
Speaker: Prof. YaoWen Chang (National Taiwan University)

Title: Automated Finger Placement for Wire-Bonding Packages Using a Double-Square Analytical Framework
Speaker: Prof. Jai-Ming Lin (National Cheng Kung University)

Papers accepted for ISSCC 2026

The following papers have been accepted for ISSCC 2026.
We will present our results in San Francisco in February 2026.

S. Xu*, K. Liu*, L. Chan, H. Tagawa, H. Shinohara, K. Niitsu, “A Sub-Threshold All-nMOS Reconfigurable PUF with Secure Configuration Selection for Stable 6-Bits/Cell,” Technical Digest of International Solid-State Circuits Conference (ISSCC), to appear. (*ECAs)

Q. Cheng*, Z. Yang*, H. Li, Q. Li, Z. Kong, G. Niu, Y. Liang, J. Li, J. Yoo, M. Hashimoto, and L. Lin, “A Radiation-Hardened Self-Healing Cmos Imager with Online Pixel/Logic Annealing and Tile-Adaptive Compression for Space Applications,” Technical Digest of International Solid-State Circuits Conference (ISSCC), to appear. (*ECAs)

Papers accepted for DATE 2026

The following papers have been accepted for DATE 2026.
We will present our results in Verona, Italy, in April 2026.

  • Quan Cheng, Haoyuan Li, Wang Liao, Feng Liang, Longyang Lin, Masanori Hashimoto, “Gohan: A Golden-Copy-Aided Platform Enabling Online Hybrid-Interactive Reliability Analysis,” Proc. DATE, to appear.
  • Quan Cheng, Haoyuan Li, Zhenzhe Chen, Wang Liao, Jing-jia Liou, Masanori Hashimoto, Longyang Lin, “Ramen: Radiation-Aware Modeling Framework for PDK-Enabled Design and Library Characterization,” Proc. DATE, to appear.

IEEE A-SSCC 2025

At the IEEE Asian Solid-State Circuits Conference (IEEE A-SSCC 2025) held in Daejeon, South Korea, from November 2 to 5, 2025, Ms. Xu (D3) presented the following paper (presentation took place on November 3).

  • Shufan Xu*, Kunyang Liu*, Nan Wang, Hirofumi Shinohara and Kiichi Niitsu, “A Less than 6.5E−8 BER 36-Way Reconfigurable PUF with 4-bit Stable Responses per Cell Featuring Machine Learning-Based Best-Configuration Selection,” in Proceedings of IEEE Asian Solid-State Circuits Conference (A-SSCC), Daejeon, South Korea, Nov. 2025, pp.103-105. (*Equally Credited Authors)

ICCAD2025

At International Conference on Computer-Aided Design (ICCAD 2025), held in Munich, Germany from October 26 to October 31, 2025, Hashimoto and Guo gave presentations on the following papers (presentation dates: October 27 and October 28, respectively).

  • Quan Cheng, Huizi Zhang, Chien-Hsing Liang, Mingtao Zhang, Jing-Jia Liou, Jinjun Xiong, Longyang Lin and Masanori Hashimoto, “Tenpura: a General Transient Fault Evaluation and Scope Narrowing Platform for Ultra-Fast Reliability Analysis,” in Proceedings of International Conference on Computer-Aided Design (ICCAD), pp.1-6, Oct. 2025.
  • Xinyi Guo, Geguang Miao, Shinichi Nishizawa, Hiromitsu Awano, Shinji Kimura, and Takashi Sato, “SOME: Symmetric One-Hot Matching Elector — A Lightweight Microsecond Decoder for Quantum Error Correction,” in Proceedings of International Conference on Computer-Aided Design (ICCAD), pp.1-6, Oct. 2025.

IEEE SENSORS 2025

At the IEEE SENSORS 2025 held in Vancouver, Canada, from October 19 to 22, 2025,
Mr. Sadamu (M2) and Prof. Shirai presented the following papers (both presentations took place on October 20).

  • R. Sada, T. Tanaka, H. Asaue, T. Shiotani, M. Hashimoto, and R. Shirai, “Localization of Embedded Sensors in Reinforced Concrete Via Time-Series Magnetic Field Sensing and Maximum Likelihood Estimation,” IEEE Sensors Letters, to appear.
  • R. Fukugasako, H. Asaue, T. Shiotani, M. Hashimoto, and R. Shirai, “A Current Chopper-Assisted Magnetic Field-Based Backscatter Communication Method with WPT Overcoming Ultra-Low Coupling Coefficients,” IEEE Sensors Journal, volume 25, number 10, pages 18249-18256, May 2025.

Joint Research Seminar with FAU (Friedrich-Alexander University Erlangen-Nürnberg)

From September 30 to October 2, 2025, Professor Jürgen Teich’s research group from Friedrich-Alexander-Universität Erlangen-Nürnberg (FAU), Germany, visited our laboratory for a research exchange. On September 30, a seminar featuring presentations mainly from FAU was held, and on October 1, another seminar featuring presentations mainly from Kyoto University took place. Both events included active and lively discussions.