ESWeek 2023

At Embedded Systems Week (ESWEEK 2023) held in Hamburg, Germany, from September 17 to 22, 2023, Ikeda presented his research (presentation date: September 20). The published results related to this presentation are available as the following paper.

  • Sosei Ikeda, Hiromitsu Awano, and Takashi Sato, “Modular DFR: Digital delayed feedback reservoir model for enhancing design flexibility,” ACM Transactions on Embedded Computing Systems (TECS), Vol.22, No.5s, pp.110:1-110:20, September 2023. doi: 10.1145/3609105

Paper accepted: ASP-DAC 2024

The following papers have been accepted for Asia and South Pacific Design Automation Conference (ASP-DAC) to be held in Incheon, Korea, in January 2024.

  • K. Suemitsu, K. Matsuoka, T. Sato, and M. Hashimoto, “Logic Locking Over TFHE for Securing User Data and Algorithms,” Proceedings of Asia and South Pacific Design Automation Conference (ASP-DAC), 2024, to appear.
  • K. Oshima, K. Kuribara, and T. Sato, “Design of aging-robust clonable PUF using organic thin-film transistors and insulator-based ReRAM,” in Proc. ACM/IEEE Asia and South Pacific Design Automation Conference (ASPDAC), 2024, to appear.
  • K. Matsuoka, S. Bian, and T. Sato, “HOGE: Homomorphic gates on a chip,” in Proc. ACM/IEEE Asia and South Pacific Design Automation Conference (ASPDAC) 2024, to appear.

SSDM 2023

Two research presentations were given at SSDM2023 (International Conference on Solid State Devices and Materials 2023) held at Nagoya Congress Center on September 5-8, 2023.

  • Kazunori Kuribara, Atsushi Takei, Takashi Sato, and Manabu Yoshida, “Low voltage operation of organic thin-film transistor with atmospheric coating of high-k polymer dielectric,” in Proc. International Conference on Solid State Devices and Materials (SSDM), pp.195-196, September 2023.
  • Hiroki Urabe, Kunihiro Oshima, and Takashi Sato, “Feasibility study of PLL-based analog-to-digital converter for low-voltage organic thin-film transistors,” in Proc. International Conference on Solid State Devices and Materials (SSDM), pp.795-796, September 2023.