Technical seminar

Two distinguished EDA researchers visited our laboratory to exchange ideas and deliver the following technical lectures (November 28, 2025).

Title: Physical Design for Heterogeneous Integration: Challenges and Opportunities
Speaker: Prof. YaoWen Chang (National Taiwan University)

Title: Automated Finger Placement for Wire-Bonding Packages Using a Double-Square Analytical Framework
Speaker: Prof. Jai-Ming Lin (National Cheng Kung University)

Papers accepted for ISSCC 2026

The following papers have been accepted for ISSCC 2026.
We will present our results in San Francisco in February 2026.

S. Xu*, K. Liu*, L. Chan, H. Tagawa, H. Shinohara, K. Niitsu, “A Sub-Threshold All-nMOS Reconfigurable PUF with Secure Configuration Selection for Stable 6-Bits/Cell,” Technical Digest of International Solid-State Circuits Conference (ISSCC), to appear. (*ECAs)

Q. Cheng*, Z. Yang*, H. Li, Q. Li, Z. Kong, G. Niu, Y. Liang, J. Li, J. Yoo, M. Hashimoto, and L. Lin, “A Radiation-Hardened Self-Healing Cmos Imager with Online Pixel/Logic Annealing and Tile-Adaptive Compression for Space Applications,” Technical Digest of International Solid-State Circuits Conference (ISSCC), to appear. (*ECAs)