The following paper has been accepted for IRPS 2026. It will be presented in Tucson, Arizona, in March 2026.
Yuibi Gomi, Kazusa Takami, Koyo Morita, and Masanori Hashimoto, “Proton-Induced Distant MCU Analysis with Quasi Event-Wise Dynamic Measurement in 22-nm and 55-nm SRAMs,” Proceedings of International Reliability Physics Symposium (IRPS), to appear.
At the SIGGRAPH ASIA 2025 held in Hong Kong, from December 15 to 18, 2025, Assist. Prof. Ryo Shirai and Mr. Chiraki Takahashi and Mr. Hayato Sawada, both from Rakusei High School, presented the following paper.
Chiaki Takahashi*, Hayato Sawada*, Ryo Shirai*, Masanori Hashimoto, “High-Clarity Underwater 3D Display Enabled by Electrolysis-Free Water-Mediated Wireless Power Transmission,” SIGGRAPH ASIA 2025 Posters, to appear. (*These authors contributed equally to this work.)
An IEEE CAS Industrial Distinguished Lecture was held on December 17, 2025, featuring a presentation by Mr. Koji Nii from TSMC Design Technology Japan.
Two distinguished EDA researchers visited our laboratory to exchange ideas and deliver the following technical lectures (November 28, 2025).
Title: Physical Design for Heterogeneous Integration: Challenges and Opportunities
Speaker: Prof. Yao–Wen Chang (National Taiwan University)
Title: Automated Finger Placement for Wire-Bonding Packages Using a Double-Square Analytical Framework
Speaker: Prof. Jai-Ming Lin (National Cheng Kung University)
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The following papers have been accepted for ISSCC 2026.
We will present our results in San Francisco in February 2026.
S. Xu*, K. Liu*, L. Chan, H. Tagawa, H. Shinohara, K. Niitsu, “A Sub-Threshold All-nMOS Reconfigurable PUF with Secure Configuration Selection for Stable 6-Bits/Cell,” Technical Digest of International Solid-State Circuits Conference (ISSCC), to appear. (*ECAs)
Q. Cheng*, Z. Yang*, H. Li, Q. Li, Z. Kong, G. Niu, Y. Liang, J. Li, J. Yoo, M. Hashimoto, and L. Lin, “A Radiation-Hardened Self-Healing Cmos Imager with Online Pixel/Logic Annealing and Tile-Adaptive Compression for Space Applications,” Technical Digest of International Solid-State Circuits Conference (ISSCC), to appear. (*ECAs)