Conference / Workshop

ACM IUI 2023

by users

Harimaya gave a poster presentation at 28th Annual Conference on Intelligent User Interfaces (ACM IUI) held in Sydney, Australia on March 26–31, 2023.

M. Harimaya, R. Shirai, and M. Hashimoto, “Toward Instant 3D Modeling: Highly Parallelizable Shape Reproduction Method for Soft Object Containing Numerous Tiny Position Trackers,”in Companion Proceedings of the 28th International Conference on Intelligent User Interfaces (IUI), pp. 130–133, March 2022.

Publication

Paper accepted: IEEE Access

by users

The following paper is accepted by IEEE Access. This is a collaborative work with Tokyo Institute of Technology.

Á. L. García-Arias, Y. Okoshi, M. Hashimoto, M. Motomura and J. Yu, “Recurrent Residual Networks Contain Stronger Lottery Tickets,” in IEEE Access, doi: 10.1109/ACCESS.2023.3245808.

Publication

Paper Accepted for JJAP

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The following papers have been accepted for publication in Japanese Journal of Applied Physics (JJAP). This is an outcome of the joint work with National Institute of Advanced Industrial Science.

  • Yasuhiro Ogasahara, Kazunori Kuribara, and Takashi Sato, “Measurement of 64 organic thin-film transistors in an array test structure using relay-switch board for efficient evaluation of long-term reliability,” Japanese Journal of Applied Physics (JJAP), accepted for publication. doi: 10.35848/1347-4065/acae2d
  • Yuto Kaneiwa, Kazunori Kuribara, and Takashi Sato, “Aging-robust amplifier composed of p-type low voltage OTFT and organic semiconductor load,” Japanese Journal of Applied Physics (JJAP), accepted for publication. doi: 10.35848/1347-4065/acb2be
Publication

Paper accepted: IEEE Transactions on Circuits and Systems II

by users

The following paper is accepted by IEEE Transactions on Circuits and Systems II. This is a collaborative work with Southern University of Science and Technology.

Q. Cheng, L. Dai, M. Huang, A. Shen, W. Mao, M. Hashimoto, H. Yu, “A Low-Power Sparse Convolutional Neural Network Accelerator with Pre-Encoding Radix-4 Booth Multiplier,” in IEEE Transactions on Circuits and Systems II: Express Briefs, doi: 10.1109/TCSII.2022.3231361.

Conference / Workshop

IRPS 2023

by users

The following paper has been accepted. It is the result of joint research with JAEA, the University of Tokyo, and AIST, and will be presented in Monterey, CA in March 2023.

K. Takami, Y. Gomi, S. Abe, W. Liao, S. Manabe, T. Matsumoto, and M. Hashimoto, “Characterizing SEU Cross Sections of 12- and 28-nm SRAMs for 6.0, 8.0, and 14.8 MeV Neutrons,” Proceedings of International Reliability Physics Symposium (IRPS), to appear.