ISSCC 2026

At the IEEE International Solid-State Circuits Conference (IEEE ISSCC 2026) held in San Francisco, USA, from February 15 to 19, 2026, Assistant Professor Liu presented the following paper on behalf of Ms. Xu (D3), who was unable to attend the conference (presentation took place on February 18).

  • Shufan Xu*, Kunyang Liu*, Lando Chan, Hironori Tagawa, Hirofumi Shinohara, and Kiichi Niitsu, “A Sub-Threshold All-NMOS Reconfigurable PUF with Secure Configuration Selection for Stable 6-Bits/Cell,” in IEEE Int. Solid-State Circuits Conf. (ISSCC) Tech. Dig. Papers, San Francisco, CA, USA, Feb. 2026, pp.400-401. (*Equally Credited Authors)

ISSCC 2026 Silkroad Award

D3 Student Xu-san’s paper won the Silkroad Award at the ISSCC 2026.
Since Xu-san was unable to attend the conference, Assistant Professor Liu attended the ceremony and accepted the award on her behalf.

“A Sub-Threshold All-NMOS Reconfigurable PUF with Secure Configuration Selection for Stable 6-Bits/Cell”

Authors: Shufan Xu*, Kunyang Liu*, Lando Chan, Hironori Tagawa, Hirofumi Shinohara, and Kiichi Niitsu (*Equally Credited Authors)

Paper accepted for IEEE Sensors Journal

The following paper has been accepted for publication in IEEE Sensors Journal. This work is the result of a collaborative research project with Yamagata University.

Y. Wang, T. Tanaka, T. Harada, M. Hashimoto, R. Shirai, “A Compact Triaxial Hall Sensor Compatible with Standard CMOS Process Leveraging Horizontal and Vertical Current Flow within Deep N-Well,” in IEEE Sensors Journal, DOI: 10.1109/JSEN.2026.3659496

Paper accepted for IEEE Transactions on Nuclear Science

The following paper has been accepted for publication in IEEE Transactions on Nuclear Science. This work is the result of a collaborative research project with JAXA.

K. Takeuchi and M. Hashimoto, “Sensitive Volume Allocation Aligned with a Physics-Based Analytical Cross Section Model for Monte Carlo-Based Proton-Induced SEU Simulation,” in IEEE Transactions on Nuclear Science, doi: 10.1109/TNS.2026.3654595.