2名の著名な集積回路設計技術研究者が講座を訪問し、意見交換を行うとともに、以下の技術講演会を開催しました(2025/11/28)。
Title: Physical Design for Heterogeneous Integration: Challenges and Opportunities
Speaker: Prof. Yao–Wen Chang (National Taiwan University)
Title: Automated Finger Placement for Wire-Bonding Packages Using a Double-Square Analytical Framework
Speaker: Prof. Jai-Ming Lin (National Cheng Kung University)
