Category: Conference / Workshop

Conference / Workshop/Publication

Paper accepted for publication in IEEE Sensors Letters

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The following paper has been accepted for publication in IEEE Sensors Letters:

Ryosuke Sada, Toshihisa Tanaka, Hisafumi Asaue, Tomoki Shiotani, Masanori Hashimoto, and Ryo Shirai, “Localization of Embedded Sensors in Reinforced Concrete via Time-Series Magnetic Field Sensing and Maximum Likelihood Estimation,” IEEE Sensors Letters, accepted, to appear.

We will also present this work at the IEEE Sensors Conference 2025, which will be held in Vancouver, Canada.

This work was conducted in collaboration with the Laboratory on Innovation for Infrastructures (ITIL), Office of Institutional Advancement and Communications, Kyoto University.

Conference / Workshop

Papers accepted to RADECS 2025

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Our papers have been accepted for oral presentation at the RADECS (RADiation and its Effects on Components and Systems) 2025 Conference. The conference will be held in Antwerp from September 29 to October 3.

  • K. Takeuchi and M. Hashimoto, “Sensitive Volume Allocation Aligned with a Physics-Based Analytical Cross Section Model for Monte Carlo-Based Proton-Induced SEU Simulation,” European Conference on Radiation and Its Effects on Components and Systems (RADECS), to appear.
  • Y. Gomi, K. Takami, R. Yasuda, H. Kanda, M. Fukuda, and M. Hashimoto, “Quasi Event-Wise Measurement of Neutron-Induced Multiple-Cell Upsets in 22-nm and 55-nm SRAMs,” European Conference on Radiation and Its Effects on Components and Systems (RADECS), to appear.
Conference / Workshop

Symposium on VLSI Technology and Circuits 2025

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Dr. Quan Cheng, a Program-Specific Researcher, delivered a presentation on their research findings at the Symposium on VLSI Technology and Circuits 2025, which took place in Kyoto from June 8-12, 2025 (Presentation date June 12).

Q. Cheng, Q. Li, Z. Yang, Z. Kong, G. Niu, Y. Liang, J. Li, J. H. Park, W. Liao, H. Awano, T. Sato, L. Lin, and M. Hashimoto, “A Radiation-Hardened Neuromorphic Imager with Self-Healing Spiking Pixels and Unified Spiking Neural Network for Space Robotics,” Digest of Symposium on VLSI Technology and Circuits, 2025.

Conference / Workshop

Paper accepted to MWSCAS 2025

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M1 Awano-Kun’s International Conference paper is accepted to IEEE International Midwest Symposium on Circuits and Systems (MWSCAS), which will be held in Lansing, Michigan, USA, in August 2025.

Kei Awano, You Wu, Kento Okamura, Teruaki Ono, Kohei Sakamoto, Hiroaki Kitaike, Hironori Tagawa, Jin Nakamura, Masaya Kaneko, Yuta Kimura, Hiroaki Nakamura, Shufan Xu, Ruilin Zhang, Kunyang Liu, Hirofumi Shinohara, and Kiichi Niitsu, “A 110-mV 12-pW 0.00006-mm2 7-nm FinFET Self-Oscillating Voltage Doubler Using Vertically Implemented Back-End Metal-Oxide-Metal Capacitors For Small-Formfactor Up-Conversion”, to appear.

Conference / Workshop

Paper accepted to EUSIPCO 2025

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The following paper has been accepted to European Signal Processing Conference (EUSIPCO), which will be held in Palermo, Italy in September 2025.

C. Biesinger, H. Awano, and M. Hashimoto, “Window Function-Less DFT with Reduced Noise and Latency for Real-Time Music Analysis,” Proceedings of European Signal Processing Conference (EUSIPCO), to appear.

Conference / Workshop

Paper accepted to ISLPED 2025

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The following paper has been accepted to International Symposium on Low Power Electronics and Design (ISLPED), which will be held in Iceland in August 2025.

Q. Cheng, H. Zhang, Q. Li, Y. Liang, M. Zhang, Z. Chen, R. Zhang, J. Xiong, M. Huang, L. Lin, and M. Hashimoto, “A Scalable External Memory Access and On-Chip Storage Architecture for Edge-AI Accelerators — Multi-Path Rolling Data Refresh and Layer-Wise Bank Allocation –,” Proceedings of IEEE/ACM International Symposium on Low Power Electronics and Design (ISLPED), to appear.

Conference / Workshop

Paper accepted to ITC 2025

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The following paper has been accepted to International Test Conference (ITC), which will be held in San Diego, California, USA in September 2025.

Q. Cheng, H. Chi, C. Liang, Y. Chao, H. Zhang, Y. Liang, M. Zhang, W. Liao, J. Xiong, J. Liou, M. Hashimoto, and L. Lin, “Genshin: a Generalized Framework with Software-Hardware Co-Design and Pruned Fault Injection for Reliability Analysis,” Proceedings of International Test Conference (ITC), to appear.